- 芯片焊接
- 芯片接合
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chip bonding中文什么意思
例句與用法
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- Flip chip bonding technology used in modern micro - photoelectron package
現(xiàn)代微光電子封裝中的倒裝焊技術(shù) - Flip - chip bonding technology
的柔性凸點(diǎn)技術(shù) - Design and realization of machine vision system in thermosonic flip - chip bonder
熱超聲倒裝鍵合機(jī)視覺系統(tǒng)的設(shè)計(jì)與實(shí)現(xiàn) - For the problem of poor cohesion and the difficult process follow - uply , such as mount the components in the ltcc substrate . besides , it ' s easy to short circuit between each electrode because of the small size of chip . we carried on the experiment of mount components and chip bonding
針對(duì)ltcc基板布線附著性較差，貼裝元器件等電路后續(xù)加工困難，布線容易脫落和管芯尺寸小，鍵合時(shí)各級(jí)之間容易短路的問題，進(jìn)行l(wèi)tcc基板后續(xù)貼裝和管芯鍵合工藝實(shí)驗(yàn)。 - In this thesis , the work on automatic alignment system is as follows : firstly , after the methods and optical systems for alignment whose are used commonly now are discussed , a new die leveling method based on auto - focus is presented for the flip chip bonder . auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations
本文針對(duì)倒裝貼片機(jī)的自動(dòng)對(duì)準(zhǔn)系統(tǒng)開展了以下幾方面的工作:首先在討論了現(xiàn)有的對(duì)準(zhǔn)方法和自動(dòng)貼片機(jī)的對(duì)準(zhǔn)光路系統(tǒng)基礎(chǔ)上,針對(duì)貼片機(jī)實(shí)際應(yīng)用環(huán)境,提出基于多點(diǎn)自動(dòng)對(duì)焦的芯片調(diào)平方法。